| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the speed of packaging chip parts and safety in the insertion thereof in the packaging of the chip parts without causing the remarkable increase in the cost of a device. <P>SOLUTION: The size of a suction surface 10 of a suction nozzle 8 is set to be larger than that of chip parts 6 which are objects of packaging. In the vicinity of a position P where each of the chip parts 6 is inserted, a pressing cover 14 is provided so as to be adjacent to an upper surface of a carrier tape 2. A hole 16 is provided in the pressing cover 14 at the insertion position P, and the hole 16 is defined to have a size slightly larger than that of the forward end surface 10 of the suction nozzle 8. When each of the chip parts 6 sucked to the suction nozzle 8 is put into a parts containing recess 4 of the carrier tape 2, suction by the suction nozzle 8 is released, and the carrier tape 2 starts to move in the direction shown by an arrow. After an opening of the parts containing recess 4 is completely covered by the pressing cover 14, the suction nozzle 8 is caused to move upward. <P>COPYRIGHT: (C)2003,JPO</p> |
