发明名称 METHOD FOR PRODUCING CARRIER FOR ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a carrier for an electronic part which is excellent in mechanical strength and material characteristics in particular. SOLUTION: The method includes a process in which a crystalline plastic material, an amorphous plastic material, and a coupling agent are mixed by a mixer to produce a necessary raw materials; a process in which the mixed raw materials are supplied to an extruder to be heated/processed, and extruded from a die to mold the semi-finished product of the carrier (10) having a prescribed thickness; a process in which the semi-finished product is rolled into a prescribed size by hot rolling; a process in which the semi-finished product is molded into a prescribed shape; a process in which the molded semi-finished product is wound; and a process in which the wound carrier (10) is fed to be subjected to punching by a punching machine to form a row of positioning holes (11) arranged at prescribed intervals, and at least a row of electronic part mounting holes (12) arranged at prescribed intervals in a surface for mounting the electronic part. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003200451(A) 申请公布日期 2003.07.15
申请号 JP20020371400 申请日期 2002.12.24
申请人 YUTOKU KAGI KOFUN YUGENKOSHI 发明人 TSAI I-CHANG;TSAI JIN-AN
分类号 B29C43/22;B29C43/34;B29C69/00;B29K23/00;B29K55/02;(IPC1-7):B29C43/22 主分类号 B29C43/22
代理机构 代理人
主权项
地址