| 摘要 |
An infrared sensor is provided with a thermopile formed with a plurality of thermocouples connected to each other. The thermopile includes hot junctions, cold junctions, and thermoelectric patterns. The thermoelectric patterns are made of thermoelectric materials differing from each other. The hot junctions and the cold junctions are made of a bonding material which differs from the thermoelectric materials. A temperature-compensation resistor film is formed at a corner of the surface of a substrate on which the thermopile is formed, the temperature-compensation resistor film being made of the same material as the bonding material used for the hot junctions and the cold junctions.
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