发明名称 SPRAY NOZZLE FOR PRINTED CIRCUIT BOARD AND WET LINE FACILITY USING THE NOZZLE
摘要 PROBLEM TO BE SOLVED: To provide a spray nozzle for a printed circuit board (PCB), which is used in a PCB wet line facility, prevents the interference between liquids to be generated when the liquid is sprayed, continues to spray the liquid while keeping uniform spray pressure and is provided with a nozzle cover. SOLUTION: The spray nozzle (5) is used for spraying the liquid toward the PCB (25) under a prescribed pressure. The funnel type nozzle cover (10) is fitted to the upper part of the nozzle (5) for covering the nozzle (5). COPYRIGHT: (C)2003,JPO
申请公布号 JP2003200090(A) 申请公布日期 2003.07.15
申请号 JP20020127946 申请日期 2002.04.30
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 CHOL-WON PARK
分类号 B05B1/28;B05B15/04;H05K3/00;(IPC1-7):B05B15/04 主分类号 B05B1/28
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