发明名称 |
Polypropylene resin composition, T die film made of the same and method of producing T die film |
摘要 |
A polypropylene resin composition comprising 100 parts by weight of a polypropylene resin (A) having a die swell ratio of less than about 1.70 and about 0.01 to about 45 parts by weight of a polypropylene resin (B) having a die swell ratio of about 1.80 or more. A T die film is also provided, composing polypropylene wherein the film has a molecular weight distribution of about 4.2 or less and a die swell ratio of 1.28 or more. A method of producing a T die film is also provided, comprising the steps of melt-kneading polypropylene by an extruder, extruding the melted product through a die lip, and cool-solidifying the extruded material by a cooling roll to form a film. The film resulting by this method has a molecular weight distribution about of 4.2 or less and a die swell ratio of about 1.28 or more. Further, the present invention provides a laminated molded body comprising a heat molded body composed of a polypropylene resin composition containing 100 parts by weight of polypropylene resin (A), about 0.01 to about 45 parts by weight of a polypropylene resin (B) and a substrate comprising a thermoplastic resin.
|
申请公布号 |
US6593003(B2) |
申请公布日期 |
2003.07.15 |
申请号 |
US20020282097 |
申请日期 |
2002.10.29 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
KANAMORI KAZUNORI;KISHIRO SHIGEKI |
分类号 |
B29C47/00;B29C51/04;B29C51/10;B29C51/16;B32B27/32;C08J5/18;C08L23/10;(IPC1-7):B32B23/08;B32B27/00;B32B27/08;B32B27/10;B32B27/42 |
主分类号 |
B29C47/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|