BINDERLESS BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a binderless board which can be obtained without necessity of heating at a high temperature, has a sufficient dynamical strength, is free from problems of smell and discoloration and easy to be recycled. SOLUTION: A plant chip 4 containing hemicellulose is molded by heat pressure and a binderless board is manufactured by bonding plant chips to each other by an adhesive component contained in the plant chip 4. In this case, the binderless board is manufactured by heat pressure molding while steam is supplied to the plant chip 4. The hemicellulose or the like can be modified to an adhesive component under a comparatively low temperature condition at 160°C to 180°C by feeding steam to the plant chip 4 and can be molded by heating uniformly it by the steam. COPYRIGHT: (C)2003,JPO