| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a glass ceramic material for a multilayer circuit board which exhibits a relatively high thermal expansion coefficient in spite of its low dielectric constant. <P>SOLUTION: Glass powder containing, by mol, 30 to 60% SiO<SB>2</SB>, 20 to 40% BaO, 0 to 40% MgO, 0 to 40% ZnO, and 0 to 20% B<SB>2</SB>O<SB>3</SB>, and in which the total of the MgO and ZnO is 0 to 40%, and ceramic powder containing alumina powder are contained, and the glass powder is incorporated in ≥50 wt.%. A sintered compact obtained by firing the same contains BaO-Al<SB>2</SB>O<SB>3</SB>-2SiO<SB>2</SB>(BaAl<SB>2</SB>Si<SB>2</SB>O<SB>8</SB>) crystals, and has a Q value of ≥400 in a measuring frequency of 10 GHz. <P>COPYRIGHT: (C)2003,JPO |
