发明名称 |
Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures |
摘要 |
A method for controlling wafer uniformity in a polishing tool includes providing a plurality of carrier heads, determining a signature for each of the carrier heads, and installing carrier heads with similar signatures in a polishing tool. A processing line includes a polishing tool and a processing tool. The polishing tool is adapted to polish wafers. The polishing tool includes a plurality of carrier heads, each carrier head having a polishing signature similar to the other carrier heads. The processing tool is adapted to process the polished wafers in accordance with a recipe. At least one parameter in the recipe is based on the polishing signatures of the carrier heads.
|
申请公布号 |
US6592429(B1) |
申请公布日期 |
2003.07.15 |
申请号 |
US20000627737 |
申请日期 |
2000.07.28 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
CAMPBELL WILLIAM J. |
分类号 |
B24B41/06;B24B49/00;(IPC1-7):B24B49/00;B24B51/00;B24B1/00 |
主分类号 |
B24B41/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|