| 摘要 |
Disclosed are a semiconductor device and a method for fabricating the same and, more particularly, a method for decreasing the size of semiconductor devices by stacking two substrates, one of which has only memory cells and the other of which has only logic circuits is disclosed. The disclosed method includes forming memory cells on a first semiconductor substrate; forming logic circuits on a second semiconductor substrate; and stacking the second semiconductor substrate on the first semiconductor substrate in order that the memory cells are electrically operable to the logic circuits on the second semiconductor substrate. In the disclosed stacked semiconductor substrate, the logic circuit area is placed on the memory cell area and these two areas are electrically connected by a metal interconnection, thereby decreasing the size of the semiconductor devices.
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