发明名称 |
Offset edges mold for plastic packaging of integrated semiconductor devices |
摘要 |
A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset. |
申请公布号 |
US6592352(B1) |
申请公布日期 |
2003.07.15 |
申请号 |
US20000630499 |
申请日期 |
2000.08.02 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
POINELLI RENATO;MAZZOLA MAURO;BRIOSCHI ROBERTO |
分类号 |
B29C45/26;B29C45/14;H01L21/56;(IPC1-7):B29C45/14;B29C70/72 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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