发明名称 METHOD AND EQUIPMENT FOR CONTROLLING MOLD TEMPERATURE
摘要 PROBLEM TO BE SOLVED: To provide a method and equipment which can quickly stabilize the temperature inside a mold at a preset value while preventing a temperature overshoot inside the mold and an overheat at a mold surface. SOLUTION: The equipment is installed with surface temperature sensors 20a to 20k arranged near the surface of the mold body 10 to detect the surface temperature of the mold body 10 heated by heaters 18a to 18k, inner temperature sensors 22a to 22k arranged inside the mold body 10 to detect the inner temperature of the mold body 10 heated by heaters 18a to 18k and a controller 30 to control the temperature of heaters 18a to 18k based on the outcome from the surface temperature sensors 20a to 20k or the inner temperature sensors 22a to 22k. The controller 30 controls the temperature of the heaters 18a to 18k based on the outcome from the surface temperature sensors 20a to 20k until the outcome from the surface temperature sensors 20a to 20k hits a given temperature and, controls the temperature of the heaters 18a to 18k based on the outcome from the inner temperature sensors 22a to 22k after the outcome from the surface temperature sensors 20a to 20k has reached the given temperature. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003200426(A) 申请公布日期 2003.07.15
申请号 JP20010400473 申请日期 2001.12.28
申请人 HONDA MOTOR CO LTD 发明人 AOKI SHINJI;OKAMURA RYUICHI
分类号 B29C33/02;G05D23/00;G05D23/24;(IPC1-7):B29C33/02 主分类号 B29C33/02
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