| 摘要 |
<p>PURPOSE: To obtain a package for semiconductor element in which an encased semiconductor element can be operated normally and stably for a long term by preventing moisture in the atmosphere from intruding through an insulating base body or a cover body into a case effectively. CONSTITUTION: In a package for semiconductor element where a semiconductor element 3 is contained hermetically by bonding an insulating base body 1 and a cover body 2 through a sealing material 7 the insulating base body 1 and the sealing material 7 are composed of resin and a moisture absorbing material provided, on the surface thereof, with pares having radius in the range of 10-100Åis embedded in the insulating base body 1 and the sealing material 7.</p> |
