| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip component capable of removing concerns about the mechanical strength of ceramic devices with its central section being narrower than its bilateral section. SOLUTION: An armor film 3 is continuously formed on the central cylinder section and the bilateral prism section of a conductor film 2 and an external electrode film 4 is formed on the bilateral prism section of the conductor film 2, except for the region formed where there is no armor film. Since the mechanically weak section of the ceramic element, with its central section being narrower than the bilateral section, is reinforced by the armor film 4 extending to the bilateral prism section, concerns about the mechanical strength can be removed.</p> |
