| 摘要 |
<p>PURPOSE: To enable the normal and stable operation of a semiconductor element for a long term, by setting the length and the thickness of a lid body and the length of an insulating substrate in a specified relation, and filling the space between the side surface of the lid body and glass for fixing, with a glass part member. CONSTITUTION: In an insulating substratum 1, a semiconductor element 3 is bonded and fixed to an semiconductor element mounting part 1a, and rigidity is reinforced. On the upper surface, one end of an outer lead terminal 5 is fixed to the peripheral part of the mounting part 1a, via glass for fixing composed of crystallized glass or the like. A lid body 2 composed of a ceramic is bonded to the upper surface of the insulating substratum 1, via sealing glass 8, so as to accommodate the semiconductor element 3 in the inside and sandwich an outer lead terminal 5 between the insulating substrate and the lid, body. When the length of the insulating substrate is L1 , the length of the lid body is L2 , and the thickness of the lid body is T, deflection is scarcely generated even in the case of L1 >=L2 , L2 <=30(mm), and 0.3(mm)>=T>=0.009L2 . As the result, the airtight of the insulating substrate 1 and the semiconductor element 3 is complete, and the semiconductor element 3 can be operated normarly and stably for a long term.</p> |
