发明名称 TEST BOARD FOR SMD ELECTRONIC COMPONENT
摘要 PURPOSE: A test board for an SMD electronic component is provided to reduce a wiring operation to a minimum by using a pad and controlling use of a via, and to reduce a production costs by simplifying a power supply wiring. CONSTITUTION: Upper, lower, and center power supply wirings(22,23,24) are arranged at an upper end, a lower end, and a center of a printed circuit board. Soldering pads(21) are arranged at the right of the upper power supply wiring(22) and the left of the center power supply wiring(24). A passive component or an electronic component for an SMD is loaded on the soldering pads(21). A longitudinal length of the test board for an SMD electronic component is 52.5-420 mm. A transverse length of the test board for an SMD electronic component is 148.5-297 mm. An interval between the soldering pads(21) is 0.1-2 mm.
申请公布号 KR20030059932(A) 申请公布日期 2003.07.12
申请号 KR20020000344 申请日期 2002.01.03
申请人 CHOI, SEUNG WON;KIM, KI YEOUL;KIM, YOUNG HAK 发明人 CHOI, SEUNG WON;KIM, KI YEOUL;KIM, YOUNG HAK
分类号 G09B23/18;(IPC1-7):G09B23/18 主分类号 G09B23/18
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