METHOD FOR MANUFACTURING PCB PAD FOR MOUNTING SOLDER BALL OF BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A method for manufacturing a PCB(Printed Circuit Board) pad for mounting a solder ball of a BGA(Ball Grid Array) package is provided to be capable of minimizing the connecting failure between the solder ball and the PCB pad by using a sub-pin. CONSTITUTION: A sub pin(3) is protruded from a solder ball(4) and connected with a pad(2) of a BGA substrate(1) for fixedly mounting the BGA substrate on a PCB(5) and guiding fluid solder ball to the PCB when heating the solder ball. A predetermined hole(6) is formed and located corresponding to the sub-pin for inserting the sub-pin. A metal PCB pad(7) is formed from the peripheral portion of the hole along the inner surface of the hole for connecting the solder ball.