| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which exhibits a significant cost reduction and uses no toxic material, and also to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device comprises a semiconductor chip (11); a copper-based lead frame which comprises a die pad section (12) to mount the semiconductor chip and a plurality of leads (13) so disposed that their inner end parts are located around the die pad section, and has no residual rustproof film; copper wires (14) for directly connecting electrodes on the semiconductor chip and the inner end parts of the plurality of leads; and a resin sealing body (16) for airtightly sealing these components. Outer lead parts (17) of the plurality of leads which are projecting from the resin sealing body are provided with a water-soluble rustproof film (18) or lead-free solder film (18'), which leads to the reduction in cost and prevention of environmental contamination. In the method of manufacturing the semiconductor device, the lead frame is coated with a non-BTA antirust which dissolves at relatively low temperatures immediately after it is formed, and also the outer leads are rustproofed. Consequently, a cost can be reduced by not using precious metals and any toxic residual is not left over to following stages, which particularly increase the resin sealing reliability. <P>COPYRIGHT: (C)2003,JPO |
