| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an intelligent motor drive module with a molded package. <P>SOLUTION: The power module having a lead frame with a plurality of power switching devices Q1 to Q6 and a plurality of driving devices 14, 16, and 18 mounted thereupon. The driving devices control the power switching devices to provide power to a plurality of output leads via first wire bonds. The first wire bonds are substantially parallel to each other between the power switching devices and the output leads. The lead frame and power switching devices are enclosed in a molded package. <P>COPYRIGHT: (C)2003,JPO |
