| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable semiconductor device which has a good adhesion with a sealing resin and has no short defects at the time of mounting. <P>SOLUTION: A lead frame comprises a semiconductor chip mounting area 1 to mount a semiconductor chip 4 and a plurality of leads 2 formed at a prescribed distance from the semiconductor chip mounting area 1. The semiconductor chip mounting area 1 has a bottom face located at a higher position than those of the leads 2, and has at least one projecting part 1P projecting from the bottom face, with the end face of the projecting part being flush with the bottom faces of the leads 2. <P>COPYRIGHT: (C)2003,JPO |
