| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component, reduced in the bad affection of heat generation of an electronic component element received in a cavity and capable of being miniaturized. <P>SOLUTION: The cavity 5 for receiving the electronic component element 6 is formed in one main surface of a laminate 1 to arrange the electronic component element 6 in the cavity 5 while a thermal radiation conductor 14 for conducting heat generated by the electronic component element 6 to the outside of the laminate along the direction of plane of the laminate 1 is arranged. <P>COPYRIGHT: (C)2003,JPO |
