| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce influence from crosstalk noise and EMI noise in a multilayer wiring substrate having an orthogonal parallel wiring group. <P>SOLUTION: The multilayer is provided with a laminated wiring board. The wiring board comprises a first parallel wiring group L1 which is formed on a first insulation layer (13), and each proceeds to a point of intersection in predetermined each section area; a second parallel wiring group L2 which is formed on a second insulation layer (14) laminated on the first insulation layer (13), and is each orthogonal to the first parallel wiring group L1 in each section area; and a through conductor group T for electrically connecting them. The first parallel wiring group L1 has an earth wiring G1 in each section area and is encircled by a circular earth wiring GR formed on the periphery of the first insulation layer (13), and the earth wiring G1 is electrically connected to the circular earth wiring GR such that a wiring at the outermost wiring of the second parallel wiring group L2 is an earth wiring G2. The circular earth wiring GR allows reducing an influence from EMI noise. <P>COPYRIGHT: (C)2003,JPO</p> |
