| 摘要 |
PROBLEM TO BE SOLVED: To improve the conductivity to a lead electrode of a piezoelectric oscillating piece without losing the shock resistance of a piezoelectric device. SOLUTION: This piezoelectric device has a package 36 which is so arranged as to store the piezoelectric oscillating piece 32 within, fixing and supporting a part of it, and this is equipped with an electrode part 31 which is provided in a one-end region at the inner bottom of the above package, a lead electrode 52 which is provided on one side of the above piezoelectric oscillating piece and where gold, gold alloy, or silver is exposed at the surface being electrically connected to the electrode on the side of the above package, and a conductive adhesive 43 which is arranged between the electrode on the above package side and the lead electrode of the piezoelectric oscillating piece and connects them. As the above conductive adhesive, at least on the side of being brought into contact with the lead electrode of the piezoelectric oscillating piece, an epoxy or polyimide conductive adhesive 43a, and in other places, a silicon conductive adhesive 43b are arranged. COPYRIGHT: (C)2003,JPO
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