发明名称 PRINTED BOARD FOR MOUNTING POWER AMPLIFYING ELEMENT
摘要 PROBLEM TO BE SOLVED: To facilitate the matching adjustment when mounting a power amplifying element on a printed board. SOLUTION: Pattern forming meshes 12 and 13 made up of a copper wire mesh are pasted to the desired parts on a printed board 10, and terminals 11a and 11b of a power amplifying element 11 are soldered to the pattern forming meshes 12 and 13. Solder 14 is melted with a soldering iron 15, poured into the pattern forming mesh 13, and adjusted to a desired shape and dimensions, or the solder melted with a soldering iron 17 in the pattern forming mesh 12 is sucked up with a solder suction off line 18 and adjusted to a desired shape and dimensions. In this way it becomes easier to match the power amplifying element 11 to the wiring side. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003198111(A) 申请公布日期 2003.07.11
申请号 JP20010395838 申请日期 2001.12.27
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 FUJITA KATSURA;TAKENAGA KOTARO
分类号 H05K3/34;H01L23/12;H05K1/02;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址