| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for manufacturing a flexible wiring board free of patterning-related troubles involving metal wirings. SOLUTION: A metal foil 11 is mechanically polished by polishing means 91, 92, and this completely removes deposits 29 because they are ground away together with the exposed surface 22 of the foil 11. Grooves 28 generated in the mechanically treated surface 23 during the polishing process are removed together with the surface 23 in a chemical polishing process by the melting of the foil 11 in the etchant, and this results in a chemically treated flat surface 24. No patterning-related trouble occurs during the patterning of the foil 11 because the chemically treated surface 24 where the foil 11 of a laminate 12 is exposed is flat with none of the deposits 29 retained thereon. COPYRIGHT: (C)2003,JPO
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