| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor package structure that eliminates a parasitic inductance of a wire, a through hole, or the like, and prevents the increase of a transmission loss due to resonance in high-frequency signal transmission, and to provide an optical module adopting the optical semiconductor package structure. SOLUTION: A metal block 6 having a surface opposite to a first electrode 5a of a laser diode 5 is provided. A first transmission line 1 is electrically connected to the first electrode 5a of the laser diode 5 via the metal block 6. A second transmission line 2 is electrically connected to a second electrode 5b of the laser diode 5 by arranging the laser diode 5 while the second electrode 5b is in contact with the second transmission line 2. Additionally, a conductive lump 7 is preferably provided between the metal block 6 and the first electrode 5a of the laser diode 5. COPYRIGHT: (C)2003,JPO
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