| 摘要 |
PROBLEM TO BE SOLVED: To provide a submount which has excellent transmission characteristics of high frequency signals in a higher frequency range and is made small and thin, and to provide an optical semiconductor device. SOLUTION: This submount comprises a bank 5 arranged on the upper main surface of the insulation substrate, an optical semiconductor mounting part 2 consisting of a conductive layer arranged in the central part at the upper side of the bank 5, a line conductor 4 formed from the optical semiconductor mounting part 2 to the end of the upper surface approximately in parallel in the longitudinal direction of the bank 5, a lens mounting part 3 where a lens 9 optically coupled with an optical semiconductor element 11 mounted on the optical semiconductor mounting part 2 is connected to the upper surface and which is positioned on the side of the bank 5 and also on the side of the optical semiconductor mounting part 2, and a first grounding conductor layer 20 formed almost on the entire lower main surface of the insulating substrate. A second grounding conductor layer 22 is formed as an inner layer of the bank 5 on the upper main surface, and the optical semiconductor mounting part 2 is electrically connected to the first grounding conductor layer 20 through the second grounding conductor layer 22 by a penetrating conductor 21. COPYRIGHT: (C)2003,JPO
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