发明名称 VESSEL FOR RECEIVING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To resolve a problem that a glass sealing material, whose principal constituent is lead oxide glass for lowering a sealing temperature, is provided with a high dielectric constant and the electric capacity of the glass sealing material between wiring conductor layers is increased thereby generating noise whereby malfunction of an electronic component is generated. SOLUTION: A vessel for hermetically receiving the electronic component receives the electronic component 3 constituted of an insulation base body 1 and a lid body 2 connected to the base body 1 through the glass sealing material 6. The glass sealing material 6 is consisting of a glass constituent comprising 30-40 wt.% of phosphor pentoxide, 37-50 wt.% of tin monoxide, 3-10 wt.% of potassium oxide, 1-6 wt.% of zinc oxide, 1-4 wt.% of aluminum oxide and 1-3 wt.% of silicon oxide added with 16-45 wt.% of admixture of cordierite base compound as a filler. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197802(A) 申请公布日期 2003.07.11
申请号 JP20010392264 申请日期 2001.12.25
申请人 KYOCERA CORP 发明人 ITO YOSHIAKI;YATSUYAMA SHUNICHI
分类号 C04B37/00;C03C8/04;C03C8/24;C04B37/02;H01L23/10;H03H9/02;(IPC1-7):H01L23/10 主分类号 C04B37/00
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