CAP OF PACKAGE FOR HIGH FREQUENCY CIRCUIT AND THE PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a cap of a package for a high frequency circuit provided with a resonance restriction function and to provide the package using this.

SOLUTION: In the cap of the package for the high frequency circuit composed of a metallic plate, a conductive layer is arranged on a ceiling surface facing the forming surface of the high frequency circuit in the case of constituting the package through an insulating layer, and the area of the conductive layer with respect to the area S of the ceiling surface is 0.5S or more.

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