发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To inexpensively provide a delta doping technique by which the occurrence of a punch-through phenomenon that becomes a problem at the time of refining a MOSFET can be prevented and, in addition, the characteristics of a device are not sacrificed. SOLUTION: The purpose is achieved by segregating phosphorus atoms injected into a semiconductor substrate to the surface of the substrate, and utilizing the surface layer of the substrate as a delta-doped layer. The segregation means that the phosphorus atoms are distributed near the surface of the substrate at a concentration higher than that of the phosphorus atoms distributed inside the substrate. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197550(A) 申请公布日期 2003.07.11
申请号 JP20010393451 申请日期 2001.12.26
申请人 HITACHI LTD 发明人 SUWA YUJI;HASHIZUME TOMIHIRO;YAMAGUCHI KEN;FUJIMORI MASASHIGE
分类号 H01L21/22;H01L21/225;H01L21/30;H01L21/336;H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/10;H01L29/78;(IPC1-7):H01L21/22;H01L21/823 主分类号 H01L21/22
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