| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve flatness of mounting regions of components to be mounted in a multilayer ceramic substrate in which the components to be mounted are loaded on the external surface of the laminated body. <P>SOLUTION: More intensive pressing can be performed only at the particular portion which collides with a projected portion 26 by pressing a raw laminated body 23 using a metal die 24 for press having the projected portion 26. Therefore, difference of pressing pressures resulting from conductive films 4, 6 and via hole conductor 5 can be made small and amount of contraction during the baking process can also be made small. Accordingly, flatness of the bottom surface of a recessed portion 27 corresponding to the more intensively pressed portion in the laminated body 28 after the sintering process can further be improved. The components 8, 9 to be mounted can be loaded with the bottom surface of the recessed portion 27 defined as the mounting region. <P>COPYRIGHT: (C)2003,JPO |
