| 发明名称 |
BONDING WIRE FOR SEMICONDUCTOR PACKAGE, AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package bonding wire and its manufacturing method wherein the quality of signal transmission can be maintained, and which is more inexpensive than a gold one. <P>SOLUTION: A bonding wire for semiconductor device includes a core wire comprising metal other than gold, and a gold plated layer on the surface of the core wire. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003197668(A) |
申请公布日期 |
2003.07.11 |
| 申请号 |
JP20010376095 |
申请日期 |
2001.12.10 |
| 申请人 |
SENMAO KOOCHII KOFUN YUGENKOSHI |
发明人 |
RIAO PEN TEIEN |
| 分类号 |
B21C1/00;C25D7/12;H01L21/60 |
主分类号 |
B21C1/00 |
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