| 摘要 |
PROBLEM TO BE SOLVED: To easily release a stress by making guide holes formed in an end plate oval or elliptical, with long sides of the guide holes directed in a direction extended radially from the center of a substrate towards the periphery of it. SOLUTION: A multilayer printed wiring board includes at least one adhesive layer containing a thermosetting resin and is subject to laminating press at a high temperature of at 100°C or higher, with constituent materials being aligned with one another at the time of the laminating press. In the laminating press, an end plate having one or, one or more guide hole or guide recess used for alignment of the constituent materials that is oval or elliptical is used. COPYRIGHT: (C)2003,JPO |
