METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board which can prevent interlayer displacement of a circuit by preventing displacement of a circuit board. SOLUTION: The multilayer printed wiring board is manufactured through lamination and integration of a plurality of sheets of circuit boards 1 via an insulated adhesive layers 3 with prepleg 2 by laminating circuit boards 1 having formed the circuits via the prepleg 2 with at least adjacent circuit boards 1 and then molding these circuit boards 1 with the thermal pressurizing process. In this case, the side edges of both ends of the adjacent circuit boards 1 are coupled in the direction where difference of contraction coefficients generated in the circuit boards 1 due to the pressurized thermal molding is large and such pressurized thermal molding is performed under this condition. COPYRIGHT: (C)2003,JPO