发明名称 METHOD FOR MANUFACTURING THIN FILM TRANSISTOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for producing a thin film transistor in which electrostatic breakdown is prevented by irradiating a glass substrate with light in a step performing attraction/stripping thereof thereby obtaining a protective circuit equivalent to a protective element circuit. <P>SOLUTION: When strip charging of a glass substrate occurs and a voltage is discharged or enters abruptly from the ground in the vicinity of the glass substrate, a potential difference is generated between a gate line and a drain line to cause electrostatic breakdown between them. A semiconductor film of a-Si, for example, has a resistance of about 1E+14Ωwhen it is not irradiated with light but exhibits a resistance of about 1E+11Ωwhen it is irradiated with light. When the glass substrate is stripped while being irradiated with light, a potential entering from the outside is distributed laterally through a semiconductor layer and the internal element is protected against electrostatic breakdown. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003197918(A) 申请公布日期 2003.07.11
申请号 JP20010395347 申请日期 2001.12.26
申请人 NEC KAGOSHIMA LTD 发明人 NISHIDA TAKAYUKI
分类号 G02F1/1368;G09F9/00;G09F9/35;H01L29/786;(IPC1-7):H01L29/786;G02F1/136 主分类号 G02F1/1368
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