DEVICE FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE FOR SUPPORTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a mechanism in which the occurrence of wear or chipping through contact can be suppressed even if a wafer supporting pin inclines due to temperature variation in a chamber or machining error.

SOLUTION: A susceptor 4 is provided with a two-stage through hole 22 having an upper large diameter and a lower small diameter. The through hole 22 includes a cup-like hole 22' having a spherical concave face at the part linking the large diameter and the small diameter, and the central point of the spherical face exists on the central axis of the through hole 22. Upper end of a wafer supporting pin 11 is provided with a head 24 having a spherical convex face corresponding to the spherical face of the through hole 22 and comes into face-contact with the cup-like hole 22'. According to the arrangement, the occurrence of wear or chipping through contact can be suppressed even if the wafer supporting pin 11 inclines due to temperature variation or machining error.

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