| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring substrate which can successfully maintain the connections of unisotropic conductive films at an outer lead portion and adequately cope with the fine pitching of an inner lead portion. SOLUTION: The inner lead portion 4 connected to an IC chip 7 for drive is formed on the surface of a base material 2 to mount the IC chip for drive, while the outer lead portion 3 connected to a liquid crystal display panel is formed on the surface of the base material 2 where the IC chip for drive is not mounted. COPYRIGHT: (C)2003,JPO |
