| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC chip sealing part capable of firmly sealing an IC chip by a polymer member and to provide IC chip mounting media having the IC chip sealing part. <P>SOLUTION: The IC chip media are so formed that a projection part composed of the polymer member is formed surrounding the IC chip and the height of the projection is 0.7-2 times as high as the height of the IC chip. It is preferable that the IC chip media are provided with an antenna part with the IC chip mounted thereon and, at least, a single sheet is laminated on the base material constituted by forming the projecting part surrounding the IC chip and composed of the polymer member. <P>COPYRIGHT: (C)2003,JPO</p> |
