METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE EQUIPPED WITH METALLIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which a metallic substrate is provided to improve reliability and service life of the semiconductor device by its high thermal conductivity.

SOLUTION: This method of manufacturing the semiconductor device equipped with the metallic substrate includes at least following steps: providing a semiconductor substrate as a temporary substrate; forming at least one semiconductor layer on the semiconductor substrate; forming the metallic substrate on the semiconductor layer, and removing the semiconductor substrate finally. The high thermal conductivity of the metallic substrate improves the reliability and service life of the semiconductor device.

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