| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily join a transistor element and a diode element reversely in parallel without requiring wire bonding. <P>SOLUTION: The transistor element 26 is mounted on a conductive plate 24 on an insulating substrate 22 and an emitter electrode on the top surface of the transistor element 26 and an anode electrode on the reverse surface of the diode element are joined together through one end of a 1st strip electrode plate 30. Further, a 2nd electrode plate 32 is extended and joined with a cathode electrode on the top surface of the diode element 28 and the conductive plate 24 which is in contact with the emitter electrode on the reverse surface of the transistor element 26. Consequently, the transistor element 26 and diode element 28 can be connected reversely in parallel without requiring wire bonding. <P>COPYRIGHT: (C)2003,JPO</p> |
