| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive and a circuit board using it capable of coping with pitch narrowing without flocculation and irregularity of metallic particles of the anisotropic conductive adhesive mixed with the metallic particles. SOLUTION: In the anisotropic conductive adhesive, by heating and pressurizing mutually facing circuit electrodes, the electrodes are electrically connected in a pressurizing direction. The metallic particles are used as conductive particles dispersed in the adhesive, the metallic particles are spherical particles manufactured by contacting metal chloride gas and reducing gas, and a dispersed amount of the metallic particles is 0.2-20 vol.%. COPYRIGHT: (C)2003,JPO
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