| 摘要 |
PROBLEM TO BE SOLVED: To reliably house a semiconductor element emitting a large quantity of heat over a long period by effectively reducing distortion caused by thermal stress between a substrate and a frame body. SOLUTION: This package is provided with the substrate 1 provided with a mounting part 1a for mounting the semiconductor element B on its top surface, and the frame body 3 which is bonded to the top surface of the substrate 1 so as to surround the mounting part 1a and which has an input/output part 3a formed at its side part. Between the substrate 1 and the frame body 3, a frame-like member 2 which has a Young's modulus of 100 to 120 GPa and a thickness of 0.05 to 0.5 mm, which is obtained by making the end faces of a belt-like metallic plate face each other and which has a chamfering part having a width of 0.01 to 0.1 mm formed at an edge between the end faces and a main surface is brazed. COPYRIGHT: (C)2003,JPO
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