| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor devices wherein generation of particles during the mounting process is lessened by reducing chipping through prevention of dicing blade clogging during the dicing process. SOLUTION: In a method for manufacturing semiconductor devices wherein a plurality of semiconductor elements formed on a wafer 5 are separated into individual devices by a dicing saw cutting the wafer 5 along scribe lines 30 in between the elements, at least the metal pattern is removed before dicing from the dicing lines 40 along which the wafer 5 is to be cut by the saw. COPYRIGHT: (C)2003,JPO |
