发明名称 CONTINUOUS ANTIFUSE MATERIAL IN MEMORY STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a memory structure comprising an antifuse material and a forming method for the antifuse materials which can reduce electric short circuits in an antifuse structure and shorten the time and processes needed to manufacture the memory structure. SOLUTION: The memory structure (700) has the antifuse material (16) that is unpatterned and sandwiched between each of a plurality of antifuse electrode pairs. The antifuse material is continuous between the antifuse electrode pairs. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197867(A) 申请公布日期 2003.07.11
申请号 JP20020337541 申请日期 2002.11.21
申请人 HEWLETT PACKARD CO <HP> 发明人 VAN BROCKLIN ANDREW L;ELDREDGE KENNETH J;WANG S JONATHAN;PERNER FREDERICK A;FRICKE PETER
分类号 H01L21/82;H01L23/525;H01L27/10;H01L27/12;(IPC1-7):H01L27/10 主分类号 H01L21/82
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