发明名称 |
CONTINUOUS ANTIFUSE MATERIAL IN MEMORY STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a memory structure comprising an antifuse material and a forming method for the antifuse materials which can reduce electric short circuits in an antifuse structure and shorten the time and processes needed to manufacture the memory structure. SOLUTION: The memory structure (700) has the antifuse material (16) that is unpatterned and sandwiched between each of a plurality of antifuse electrode pairs. The antifuse material is continuous between the antifuse electrode pairs. COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003197867(A) |
申请公布日期 |
2003.07.11 |
申请号 |
JP20020337541 |
申请日期 |
2002.11.21 |
申请人 |
HEWLETT PACKARD CO <HP> |
发明人 |
VAN BROCKLIN ANDREW L;ELDREDGE KENNETH J;WANG S JONATHAN;PERNER FREDERICK A;FRICKE PETER |
分类号 |
H01L21/82;H01L23/525;H01L27/10;H01L27/12;(IPC1-7):H01L27/10 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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