发明名称 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a structure which enables to easily separate a mask film coated on a printed wiring board. SOLUTION: The printed wiring board 1 comprises an insulation base material 2, a wiring pattern formed of a metal foil formed on the surface of the insulation base material 2, a resist film for permanently covering the wiring pattern 3 having some part uncovered and exposed, and a mask film 4 for temporarily protecting at least part of the exposed part of the wiring pattern 3 which becomes connection terminals 3 from damages and contamination. Dummy patterns 3d formed of a metal foil are provided in the edge of a region where the mask film 4 is disposed, enabling easy separation of the mask film 4 by a gap generated between the mask film 4 and the base material 2. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003198078(A) 申请公布日期 2003.07.11
申请号 JP20010400177 申请日期 2001.12.28
申请人 NIDEC COPAL CORP 发明人 NAKAYAMA HIROSHI
分类号 H05K3/28;H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K3/28
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