| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and apparatus which can stably process a substrate for a long period of time by preventing corrosion of the wiring metal resulting from acidic substances and moistened ozone gas and by reducing amount of use of high purity acetic acid. SOLUTION: In the substrate processing method organic substances at the surface of substrate are removed with the gas including ozone moistened by the processing solution. As the processing solution, a mixed solution of acetic acid and water may be used. Accordingly, because of use of the mixed solution of acetic acid and water and no use of a high concentration chemical solution the substrate can be processed while corrosion of wiring metal is suppressed. COPYRIGHT: (C)2003,JPO
|
