发明名称 METHOD AND APPARATUS FOR MANUFACTURING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To conduct a dipping step for manufacturing a product having high reliability. SOLUTION: The method for manufacturing the circuit board comprises the steps of relaxing a long-sized board 10 conveyed by first and second rollers 20, 22 between the rollers 20 and 22, dipping the board in a liquid 30 so that at least one of the rollers 20, 22 is a drive roller 20, disposing a sensor 50 for detecting a position of the board 10 in a liquid tank 32 and a liquid jet port 40, and regulating the looseness of the board 10, thereby controlling the conveying route of the board 10 in the liquid. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003198097(A) 申请公布日期 2003.07.11
申请号 JP20010400237 申请日期 2001.12.28
申请人 SEIKO EPSON CORP 发明人 GOMI TSUGIO
分类号 H05K3/00;B08B3/08;B65G49/00;H01L21/00;H05K3/06;H05K3/18;H05K3/26;(IPC1-7):H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址