| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of effectively relaxing stress by the heat-shrinking of a package applied to a wiring layer of multi-layer structure and preventing the occurrence of a crack of a passivation film which is a film to protect a chip, or the like. SOLUTION: In the semiconductor device equipped with the multi-layer wiring structure in which lower layer wiring 13 and upper layer wiring 15 are formed on a semiconductor board 11 with an interlayer insulation film 14 between, the purpose is achieved by the semiconductor device equipped with the multi- layer wiring structure, which is characterized in that an opening in an interlayer insulation film 14 is made small to provide a wider area of the interlayer insulation film 14. COPYRIGHT: (C)2003,JPO
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