| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting a semiconductor device capable of shortening a TAT in an inspection and mesurement process. SOLUTION: A host computer 10, having data on the semiconductor device to be manufactured such as circuit pattern data on the semiconductor device, composition data and optical constants of films constructing the semiconductor device to be subjected to inspection and measurement, and, shot layout data on a semiconductor wafer, etc., and an inspection and measurement device, concerned with a semiconductor manufacturing process, e.g. a film thickness measuring apparatus 20, a defect inspecting apparatus 21, an electrical characteristic measuring apparatus 22, a step height measuring apparatus 23 and a resistance measuring apparatus 24, etc., are connected to a network. The condition of the inspection and measurement is set up at the host computer, e.g. for every manufacturing lot of the semiconductor device, before the inspection and measurement process is started, e.g. before the manufacturing process is started. COPYRIGHT: (C)2003,JPO
|
