发明名称 APPARATUS AND METHOD FOR IMPLANTING FILM CARRIER TAPE FOR MOUNTING ELECTRONIC ELEMENT, AND METHOD FOR MANUFACTURING THE FILM CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To perform an implanting method with high productivity and at low cost by speedily and precisely punching a large number of implanting holes at a base film tape and speedily and precisely burying implanting metallic materials into these implanting holes. SOLUTION: A film carrier tape has a metallic layer formed on one or both of its surfaces by using an implanting die obtained by symmetrically arranging an implanting hole boring part and an implanting part within a single die. The implanting holes are bored by punching by implanting hole boring pins arranged at the implanting hole boring part of the implanting die. To the film carrier tape having the implanting holes bored, the implanting metallic material of an implanting metallic sheet material is buried into the implanting holes bored at the implanting metallic sheet material by punching by the implanting pins arranged at the implanting part of the implanting die. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003197692(A) 申请公布日期 2003.07.11
申请号 JP20010400581 申请日期 2001.12.28
申请人 SUZUKI CO LTD;MITSUI MINING & SMELTING CO LTD 发明人 NAKAMURA TOSHIYUKI;KARASAWA FUMIAKI;ICHIYANAGI AKIRA;HAYASHI KATSUHIKO
分类号 H05K3/40;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K3/40
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