发明名称 |
APPARATUS AND METHOD FOR IMPLANTING FILM CARRIER TAPE FOR MOUNTING ELECTRONIC ELEMENT, AND METHOD FOR MANUFACTURING THE FILM CARRIER TAPE |
摘要 |
PROBLEM TO BE SOLVED: To perform an implanting method with high productivity and at low cost by speedily and precisely punching a large number of implanting holes at a base film tape and speedily and precisely burying implanting metallic materials into these implanting holes. SOLUTION: A film carrier tape has a metallic layer formed on one or both of its surfaces by using an implanting die obtained by symmetrically arranging an implanting hole boring part and an implanting part within a single die. The implanting holes are bored by punching by implanting hole boring pins arranged at the implanting hole boring part of the implanting die. To the film carrier tape having the implanting holes bored, the implanting metallic material of an implanting metallic sheet material is buried into the implanting holes bored at the implanting metallic sheet material by punching by the implanting pins arranged at the implanting part of the implanting die. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003197692(A) |
申请公布日期 |
2003.07.11 |
申请号 |
JP20010400581 |
申请日期 |
2001.12.28 |
申请人 |
SUZUKI CO LTD;MITSUI MINING & SMELTING CO LTD |
发明人 |
NAKAMURA TOSHIYUKI;KARASAWA FUMIAKI;ICHIYANAGI AKIRA;HAYASHI KATSUHIKO |
分类号 |
H05K3/40;H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H05K3/40 |
代理机构 |
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主权项 |
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地址 |
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