| 摘要 |
PROBLEM TO BE SOLVED: To suppress solder from creeping up onto the side surface of a columnar electrode upon flip chip mounting of a semiconductor device having the columnar electrode. SOLUTION: A flip chip mounting columnar electrode 7 formed on a principal surface of a semiconductor chip 2 includes a protruded conductor 3 made of a film such as a copper film, and a plate shaped conductor 6. The plate shaped conductor 6 includes a soldered barrier conductor 4 such as a nickel film, and an easy soldering conductor 5 such as a gold film. A solder is suppressed from creeping on a side surface of the protruded conductor 3 of the columnar electrode 7 to improve the connection reliability of the flip chip mounting. COPYRIGHT: (C)2003,JPO
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